Taken from the Intel Website
May 5, 2008 - Intel Corporation,
Samsung Electronics and TSMC today announced they have reached
agreement on the need for industry-wide collaboration to target a
transition to larger, 450mm-sized wafers starting in 2012. The
transition to larger wafers will enable continued growth of the
semiconductor industry and helps maintain a reasonable cost structure
for future integrated circuit manufacturing and applications.
The companies will cooperate with the semiconductor industry to help
ensure that all of the required components, infrastructure and
capability are developed and tested for a pilot line by this target
date.
Historically, manufacturing with larger wafers helps increase the
ability to produce semiconductors at a lower cost. The total silicon
surface area of a 450mm wafer and the number of printed die (individual
computer chips, for example) is more than twice that of a 300mm wafer.
The bigger wafers help lower the production cost per chip.
Additionally, through more efficient use of energy, water and other
resources, bigger wafers can help diminish overall use of resources per
chip. For example, the conversion from 200mm wafers to 300mm wafers
helped reduce aggregate emissions per chip of air pollution, global
warming gasses and water, and further reduction is expected with a
transition to 450mm wafers.
Intel, Samsung and TSMC indicate that the semiconductor industry can
improve its return on investment and substantially reduce 450mm
research and development costs by applying aligned standards,
rationalizing changes from 300mm infrastructure and automation, and
working toward a common timeline. The companies also agree that a
cooperative approach will help minimize risk and transition costs.
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