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Toshiba starts sample shipping of SpursEngine

Tuesday, 6 May 2008 3:47 PM

Take from the Toshiba Website

TOKYO--Toshiba Corporation today announced the start of sample shipping of the SpursEngine™ SE1000 (SpursEngine), a high-performance stream processor integrating four Synergistic Processing Element (SPE) cores derived from the "Cell Broadband Engine™" (Cell/B.E.™). Sample shipping started from today, and Toshiba expects sales of 6 million units within the first three years of the SpursEngine's release.

SpursEngine is a co-processor that integrates a hardware codec for Full HD encoding and decoding of MPEG-2 and H.264 streams with four SPEs derived from Cell/B.E. These advanced processing elements offer high performance media streaming capabilities, with a clock frequency of 1.5GHz, while achieving low power consumption range of 10W to 20W.

"We are very pleased to have started sample shipping of SpursEngine" said Yoshio Masubuchi, Director of Toshiba's System LSI Division, Advanced SoC Development Center. "The design of this powerful co-processor is dedicated to bringing the advanced capabilities of the Cell/B.E.™ to consumer electronics, particularly video processing in digital consumer products. We are sure that SpursEngine will accelerate the market for full-HD applications."

Toshiba will support developers working on SpursEngine applications with a comprehensive reference kit that includes a reference board and essential middleware APIs. The reference board has a PCI-Express edge connector that can connect to an x1 layer slot in a PC. Toshiba will also provide an integrated development environment (SPE compiler, SPE debugger, and performance monitor) and sample applications that demonstrate how to use the provided middleware. With the reference kit, customers can quickly and easily construct an evaluation and development environment and accelerate product development.

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Toshiba

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Intel, Samsung Electronics, TSMC Reach Agreement

Tuesday, 6 May 2008 3:34 PM

 Taken from the Intel Website

 

May 5, 2008 - Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.


The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.


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Review: HP ProCurve 1700-24

Tuesday, 6 May 2008 8:45 AM

Original article taken from PCMAG.com

HP ProCurve 1700-24 - Overview

The ProCurve family has been around for a long time, so it's both robust and mature. The new 1700 class of switches adds a new attribute: low cost (as little as $200). That's what you pay for the HP ProCurve 1700-24, a decent starter switch for a small business looking to expand its network port count. A managed 24-port switch for that little cheddar won't have the bells and whistles of, say, a D-Link xStack DGS-3627, of course. You'll immediately notice that only two ports support Gigabit Ethernet, and there's no support for Power over Ethernet (PoE). With a rapidly increasing number of networking products, especially wireless APs and VoIP hardware, that make use of PoE, its absence limits this ProCurve's ability to act as the center of an SMB network. The rest of the switch, however, competes well enough with other 24-port switches I've tested.

HP ProCurve 1700-24 - Diagram

 

Click here to view the original article from PCMAG.com.

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